GE 259B2460BTG2 Backplane Assembly Board

Board Type:Advanced Backplane Assembly

Model Number:259B2460BTG2

Material:High-grade aluminum alloy for superior thermal conductivity and durability

Dimensions:450mm x 100mm x 10mm

Weight:Approximately 1.5kg

Data Transmission Speed:Up to 10 Gbps

Power Consumption:Low power design for energy efficiency

Operating Temperature Range:-20°C to +70°C

Compliance Standards:UL, CE, FCC certified for global compatibility

Connector Compatibility:Supports various industry-standard connectors for seamless integration

    The GE 259B2460BTG2 Backplane Assembly Board is meticulously designed to ensure reliable data transmission in harsh industrial environments. Its high-grade aluminum alloy construction ensures excellent thermal management and durability, essential for long-lasting performance in demanding applications.

    With support for up to 10 Gbps data transfer rates, this board significantly boosts the speed and efficiency of information exchange within your automation system. Its low power consumption design ensures minimal energy usage, making it an eco-friendly choice for your facility.

    The board’s broad operating temperature range (-20°C to +70°C) allows for versatile deployment across various climates, from freezing cold to extreme heat. This wide tolerance ensures consistent performance without the need for temperature-controlled environments.

    Certified to UL, CE, and FCC standards, the GE 259B2460BTG2 complies with international safety and interoperability requirements, ensuring it can be seamlessly integrated into existing systems without legal or operational concerns.

    Featuring compatibility with a range of industry-standard connectors, this backplane assembly board simplifies installation and maintenance processes, allowing for quick setup and easy upgrades to meet evolving system needs.