Component Type:Microprocessor-controlled PCB
Technology:Advanced microprocessor technology
Operating Frequency:Up to 50 MHz
Memory Capacity:64 KB RAM, 128 KB ROM
Communication Protocol:Supports Ethernet, RS-232, RS-485
Power Consumption:5W (Max)
Operating Temperature Range:-20°C to +60°C
Dimensions:100mm x 100mm x 30mm
Material:High-grade FR4 epoxy resin
Certifications:CE, UL, CSA
This PCB module is engineered with high-quality materials to withstand harsh industrial environments, ensuring durability and longevity.
It features an advanced design that supports seamless integration into existing automation systems, streamlining production lines and enhancing operational efficiency.
With its robust communication capabilities, the AB 1336-BDB-SP17C facilitates smooth data exchange, enabling real-time monitoring and control over complex processes.
Optimized for energy efficiency, this board ensures minimal power consumption without compromising on performance, making it an ideal choice for eco-conscious manufacturers.
Designed with user-friendliness in mind, the module includes intuitive interface options for easy setup and maintenance, reducing downtime and improving productivity.
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